PACKAGE AND PACKAGE ASSEMBLY FOR POWER DEVICE

摘要

A package and a package assembly for a poser device are provided to increase the surface path from a lead to a heat sink as a conductor by including an unevenness part on a package between a lead and a heat sink attached to the surface of a package. A power device(101) includes an unevenness part(200) formed on a package(100) between an outwardly protruded lead and a heat sink(150) attached to the surface of a package. The maximum height of the unevenness part is smaller than the height of a portion in contact with the heat sink attached to the surface of the package. The unevenness part can be formed on the edge of the package in which the lead is disposed.