| 摘要 |
PROBLEM TO BE SOLVED: To provide a complex which has an epoxy resin-cured layer excellent in adhesion to a different kind of material, particularly, a metal, and also excellent in flexibility (followability). SOLUTION: A curable epoxy resin composition comprises: an ingredient (A) as a liquid epoxy resin at 25°C, which contains 30-100 mass% diglycidyl ether obtained from polyether glycol with a number-average molecular weight of 200-2,000, and another 0-70 mass% epoxy resin; an ingredient (B) as an acid anhydride and/or a phenolic curing agent; and an ingredient (C) as a curing accelerator. The curable epoxy resin composition is brought into contact with another component in an uncured state, and cured under the state of the contact with it, so that the epoxy resin-cured layer can be formed. The epoxy resin-cured layer and another component are integrated together to constitute the complex. COPYRIGHT: (C)2007,JPO&INPIT
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