发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which uniformity of substrate temperature is improved. SOLUTION: In a heat treatment apparatus for performing heat treatment on a substrate 9, a lamp group for radiating light onto the substrate 9 and an annular shaped auxiliary ring 31 for supporting the substrate 9 are provided. The auxiliary ring 31 has an annular shaped support portion 311 projected inwardly from an inner circumferential surface 310, and the support portion 311 supports an outer edge 91 of the substrate 9 by being contact with the bottom of the outer edge. In the heat treatment apparatus, the lamp group is divided into multiple small groups, to which electricity is provided separately, and the small groups include a small group that radiates light primarily toward the auxiliary ring. A support width W in which the substrate 9 is in contact with the support portion 311 and a support portion thickness T that is the thickness of the support portion 311 are determined so as to satisfy predetermined conditions. This improves uniformity of the temperature of a substrate to be heated. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007184625(A) 申请公布日期 2007.07.19
申请号 JP20070031554 申请日期 2007.02.13
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 KOBAYASHI TOSHIYUKI;KOYAMA YOSHIHIRO;TAKAHASHI MITSUKAZU
分类号 H01L21/31;H01L21/26 主分类号 H01L21/31
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