ELEMENT FOR RESISTANCE EVALUATION AND PACKAGE PROCESS EVALUATION METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method which evaluates the physical resistance in a package process with high precision and high sensitivity.

SOLUTION: The element for evaluation of the physical resistance in the package process of a semiconductor device is equipped with a substrate 1, an interconnection film 3 prepared on the substrate 1, and an insulation film 2 whose elastic modulus is 15 GPa or less prepared in the lower layer and/or the upper layer of the interconnection film 3.

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