发明名称 METHOD OF DEPOSITING AN AMORPHOUS CARBON LAYER
摘要 A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
申请公布号 US2007128538(A1) 申请公布日期 2007.06.07
申请号 US20070673177 申请日期 2007.02.09
申请人 APPLIED MATERIALS, INC. 发明人 FAIRBAIRN KEVIN;RICE MICHAEL;WEIDMAN TIMOTHY;NGAI CHRISTOPHER S.;LATCHFORD IAN S.;BENCHER CHRISTOPHER D.;WANG YUXIANG M.
分类号 G03C8/00;H01L21/20;H01L21/027;H01L21/28;H01L21/308;H01L21/311;H01L21/314;H01L21/316;H01L21/3213;H01L21/768 主分类号 G03C8/00
代理机构 代理人
主权项
地址