发明名称 |
METHOD OF DEPOSITING AN AMORPHOUS CARBON LAYER |
摘要 |
A method of forming an integrated circuit using an amorphous carbon film. The amorphous carbon film is formed by thermally decomposing a gas mixture comprising a hydrocarbon compound and an inert gas. The amorphous carbon film is compatible with integrated circuit fabrication processes. In one integrated circuit fabrication process, the amorphous carbon film is used as a hardmask. In another integrated circuit fabrication process, the amorphous carbon film is an anti-reflective coating (ARC) for deep ultraviolet (DUV) lithography. In yet another integrated circuit fabrication process, a multi-layer amorphous carbon anti-reflective coating is used for DUV lithography.
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申请公布号 |
US2007128538(A1) |
申请公布日期 |
2007.06.07 |
申请号 |
US20070673177 |
申请日期 |
2007.02.09 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
FAIRBAIRN KEVIN;RICE MICHAEL;WEIDMAN TIMOTHY;NGAI CHRISTOPHER S.;LATCHFORD IAN S.;BENCHER CHRISTOPHER D.;WANG YUXIANG M. |
分类号 |
G03C8/00;H01L21/20;H01L21/027;H01L21/28;H01L21/308;H01L21/311;H01L21/314;H01L21/316;H01L21/3213;H01L21/768 |
主分类号 |
G03C8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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