POLISHING COMPOSITION AND POLISHING METHOD

摘要

Disclosed is a polishing composition containing abrasive grains, an oxidizing agent, an electrolyte and an aqueous medium. This polishing composition is characterized in that ions produced from the electrolyte are composed of ammonium ions, at least one kind of organic carboxylate ions selected from the group consisting of polyvalent carboxylate ions and hydroxycarboxylate ions, and at least one kind of ions selected from the group consisting of carbonate ions, hydrogen carbonate ions, sulfate ions and acetate ions. After forming a wiring groove (2) in a resin substrate (1) and burying a wiring metal (3) in the wiring groove (2), the wiring metal (3) is polished by using the above-described polishing composition. Consequently, generation of scratches on the resin substrate (1) and the metal wiring (3) is kept to a minimum, while having a high polishing rate and improving the throughput.