| 摘要 |
The description provided herein relates to using an excimer laser to dry the surface of a semiconductor wafer. The excimer laser is configured to produce a laser beam. The fluence of the laser beam can be varied by a power attenuator. The number of pulses delivered to the surface is controlled by a shutter, which can block the laser beam or allow it to pass. The laser beam is directed onto the surface through a series of mirrors. A measurement device monitors the liquids on the wafer to determine whether the liquid has been evaporated.
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