发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING BONDING SHEET |
摘要 |
A method of manufacturing a semiconductor device includes the steps of: preparing a bonding sheet having one or more holes that penetrate from a first surface to an opposite second surface thereof, and a semiconductor wafer having a semiconductor element; affixing the bonding sheet to a predetermined surface of the semiconductor wafer; and evacuating gas present between the bonding sheet and the semiconductor wafer via the one or more holes.
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申请公布号 |
US2006263941(A1) |
申请公布日期 |
2006.11.23 |
申请号 |
US20060277928 |
申请日期 |
2006.03.29 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SUZUKI SHINSUKE |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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