| 摘要 |
PROBLEM TO BE SOLVED: To enhance adhesiveness between a sheet-like substrate of aromatic polyamide and a thin film layer of copper. SOLUTION: The substrate for flexible printed circuit is produced by laminating a thin film layer of copper and a substrate of aromatic polyamide film through an alloy layer of nickel and chromium wherein adhesion between the thin film layer of copper and the substrate after heat treatment at a temperature of 150°C in the air for 168 hours sustains 70% or more of adhesion before heat treatment. COPYRIGHT: (C)2007,JPO&INPIT |
