| 摘要 |
<p>The device has a mounting surface for a component (2) and a number of stacked heat sink layers (5-8), touching one another. Individual heat sink layers (7,8) have a two or three-dimensional cooling structure with an inlet (3) and an outlet (4) for a cooling medium. The ratio of the specific flow resistance between the part nearest the mounting surface and the part furthest from the mounting surface increases from the inlet to the outlet.</p> |
