Polishing composition

摘要

A polishing composition for aluminum disks, substrates having silica on their surfaces and semiconductor wafers, comprising a stable aqueous silica sol containing moniliform colloidal silica particles having the ratio (D1/D2) of a particle diameter (D1 nm) measured by dynamic light scattering method to a mean particle diameter (a particle diameter measured by nitrogen adsorption method: D2 nm) is 3 or more, and D1 being 50 to 800 nm, and which are composed of spherical colloidal silica particles having a mean particle diameter of 10 to 120 nm and metal oxide-containing silica bonding these spherical colloidal silica particles, and wherein the spherical colloidal silica particles link in rows in only one plane by observation through on electron microscope, wherein the polishing composition comprises 0.5 to 50% by weight of moniliform colloidal silica particles as SiO2 concentration.