发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>An amorphous layer (101) is formed in a region between the surface and the first depth (A) of a semiconductor substrate (100). At this time, a defect (103) occurs in the vicinity of an amorphous/crystal interface (102). Following that, the crystal structure of the amorphous layer (101) is restored by a heat treatment in a region from the first depth (A) to the second depth (B) which is shallower than the first depth (A). Consequently, the amorphous layer (101) ranges from the surface of the silicon substrate (100) to the second depth (B). In this connection, the defect (103) remains at the first depth (A). A pn junction (104) is then formed at the third depth (C), which is shallower than the second depth (B), through ion implantation.</p>
申请公布号 WO2005096357(A1) 申请公布日期 2005.10.13
申请号 WO2005JP05947 申请日期 2005.03.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;SHIBATA, SATOSHI 发明人 SHIBATA, SATOSHI
分类号 H01L29/78;H01L21/265;H01L21/324;H01L21/336;(IPC1-7):H01L21/265 主分类号 H01L29/78
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