| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a focus ring and a plasma processing apparatus with which the uniformity of the processing within a semiconductor wafer surface is improved and occurrence of the deposition on the rear-surface side of the peripheral-edge part of the semiconductor wafer is reduced as compared to that by prior art. <P>SOLUTION: A loading table 2 for loading a semiconductor wafer W and a focus ring 8 that surrounds the periphery of the semiconductor wafer W loaded on the loading table 2 are provided in a vacuum chamber 1. The focus ring 8 is constituted by a ring-shaped lower member 9, composed of a dielectric and a ring-shaped upper member 10 arranged on the upper part of the lower member 9 and is composed of an electrically conductive material. The upper surface of the outer peripheral side of the upper member 10 is made to be a flat part 10a, whose position is higher than the surface to be processed of the semiconductor wafer W. The inner peripheral part of the flat part 10a is made to be a sloping part 10b that slopes, in such a way that the outer peripheral part is higher than the lower peripheral part. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
