| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board, wiring board, board joint, and an electro-optic device capable of making uniform the height of bumps formed on a wiring pattern, and of securely obtaining conduction between elements and the wiring pattern. SOLUTION: A plurality of electrode pads having the same area are formed in electric element connection regions disposed at opposite ends of wiring 52 and having different areas, and the bumps 14a, 53 are formed on each electrode pad by an electroless plating method. COPYRIGHT: (C)2005,JPO&NCIPI
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