发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce an area occupied by a direct peripheral circuit (sense amplifier, word shunt, etc.) in a large capacity DRAM having a memory cell with a COB (Capacitor Over Bitline) structure. <P>SOLUTION: By electrically connecting an n-channel type MISFETQs in the direct peripheral circuit arranged in close to a memory array and a common source line PN<SB>1</SB>via a pad layer 16 composed of the same conductive film as that of a storage electrode 15 of the memory cell, the aspect ratio of a contact hole 22 formed at the upper part of the pad layer 16 is reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005260254(A) 申请公布日期 2005.09.22
申请号 JP20050107700 申请日期 2005.04.04
申请人 HITACHI LTD 发明人 KAJITANI KAZUHIKO;NAKAMURA MASAYUKI;TACHIBANA RIICHI;KITSUKAWA GORO
分类号 H01L21/3205;H01L21/768;H01L21/8242;H01L27/108 主分类号 H01L21/3205
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