Methods and apparatus for testing continuity of electrical paths through connectors of circuit assemblies

摘要

A device for testing continuity of electrical paths through a connector of a circuit assembly has a package containing incomplete or no mission circuitry for the circuit assembly. The package is provided with a plurality of contacts for mating to a plurality of contacts of the connector. A test sensor port is integrated with the package. A plurality of passive circuit components are integrated with the package, ones of which are coupled in parallel between ones of the contacts on the package and the test sensor port.