发明名称 PACKAGING STRUCTURE AND PORTABLE TERMINAL
摘要 <p><P>PROBLEM TO BE SOLVED: To make the electrical connections of an FPC to an electronic component sure, and to enhance the flexibility in selecting the position of the FPC to the electronic component in an electronic apparatus housing. <P>SOLUTION: A packaging structure includes a flexible circuit board 20 arranged over a step difference 23b to a high stage from a low stage, a support 23d having the step difference of the part which is brought into contact with the lower side surface of the flexible circuit board, and a motor 14 provided on the upper side face side of the flexible circuit board. The electronic component has a spring terminal 14a which is brought into contact with the land pattern 21 of the flexible circuit board in a state with the electronic component is deformed elastically in the thickness direction of the flexible circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005197290(A) 申请公布日期 2005.07.21
申请号 JP20030435329 申请日期 2003.12.26
申请人 KYOCERA CORP 发明人 KAWAGUCHI MAKOTO
分类号 H01R12/28;H04M1/02;H05K1/18;H05K7/14;(IPC1-7):H05K1/18 主分类号 H01R12/28
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