摘要 |
<p><P>PROBLEM TO BE SOLVED: To make the electrical connections of an FPC to an electronic component sure, and to enhance the flexibility in selecting the position of the FPC to the electronic component in an electronic apparatus housing. <P>SOLUTION: A packaging structure includes a flexible circuit board 20 arranged over a step difference 23b to a high stage from a low stage, a support 23d having the step difference of the part which is brought into contact with the lower side surface of the flexible circuit board, and a motor 14 provided on the upper side face side of the flexible circuit board. The electronic component has a spring terminal 14a which is brought into contact with the land pattern 21 of the flexible circuit board in a state with the electronic component is deformed elastically in the thickness direction of the flexible circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |