CURING AGENT FOR EPOXY RESIN, EPOXY RESIN COMPOSITION AND ITS CURED MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having low viscosity to enable the handling as a liquid composition and giving a cured material having excellent heat resistance. SOLUTION: The curing agent for an epoxy resin is expressed by formula (1) [R is a 1-4C alkyl; m and n are each a positive number of 1-4; X is a group expressed by either one of formulas (2-1) to (2-5); and the group (2-5) means a direct bond]. The invention further provides an epoxy resin composition containing the curing agent. COPYRIGHT: (C)2005,JPO&NCIPI