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发明名称
PLATING METHOD FOR PRINTED CIRCUIT BOARD
摘要
申请公布号
KR20050057872(A)
申请公布日期
2005.06.16
申请号
KR20030090083
申请日期
2003.12.11
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
MA, SEOG JIN
分类号
H05K3/18;(IPC1-7):H05K3/18
主分类号
H05K3/18
代理机构
代理人
主权项
地址
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