发明名称 |
Semiconductor device |
摘要 |
A semiconductor device with a package fixed to a case, comprising: a package where a semiconductor element and a lead terminal connected to the semiconductor element are sealed up; and a case formed by a frame member and an external terminal disposed to the frame member, characterized in that the package is located inside the frame of the case and the lead terminal is connected with the external terminal.
|
申请公布号 |
US6867484(B2) |
申请公布日期 |
2005.03.15 |
申请号 |
US20020247289 |
申请日期 |
2002.09.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NAKAJIMA DAI;KASHIBA YOSHIHIRO;CHUMA HIDEAKI |
分类号 |
H01L25/10;H01L25/07;H01L25/11;H01L25/18;H05K3/30;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|