| 摘要 |
FIELD: radio engineering; natural air cooled electronic modules incorporating electronic devices rated at different working temperatures. ^ SUBSTANCE: proposed horizontally mounted electronic module incorporating provision for temperature reduction in upper section relative to that in lower one has semiconducting case with upper and lower internal sections. Lower section accommodates heat-resistant electronic unit. Upper section houses heat-sensing electronic unit. Sections are isolated from one another by means of heat-conducting shields made in the form of two chassis plates disposed in a spaced relation one on top of other and being in thermal contact with case. Heat-resistant electronic unit installed in lower section is disposed in a spaced relation to lower surface of bottom chassis plate that functions to reflect thermal radiation. Electronic unit installed in upper section is disposed so that its thermal contact with top chassis plate is ensured. Part of case closing the upper section has perforated holes. ^ EFFECT: provision for installing heat-sensing unit in upper section and heat-resistant unit, in lower section. ^ 3 cl, 3 dwg |
