Semiconductor device fabrication method

摘要

A semiconductor device fabrication method for reliably separating diced semiconductor chips (15) from a dicing tape (10) without damaging the diced semiconductor chip. The method includes the steps of: attaching a wafer (11) on a dicing tape; dicing the wafer., thereby forming divided semiconductor chips; and separating the semiconductor chips from the dicing tape, wherein the step of separating includes the steps of: providing a hollow sheet (16A, 16B, 16C) having at least one aperture (18) corresponding to the semiconductor chips between the semiconductor chips attached on the dicing tape and a porous plate (21) coupled to a vacuum source (23); sucking the semiconductor chips to the porous plate via the hollow sheet by driving the vacuum source; and separating the dicing tape from the semiconductor chips under a condition where the semiconductor chips are being sucked to the porous plate.