METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, INCLUDING STEPS OF PLATED FILM PROTECTION

摘要

PURPOSE: A method is provided to achieve improved quality of printed circuit board by preventing the plated film formed inside of a hole from being stripped off. CONSTITUTION: A method comprises a step(s1) of cutting a disk into panels; a step of drilling holes at the outer peripheries of the cut panels; a step of cleaning inner surfaces of the holes; a step of plating inner surfaces of the holes; a step of removing oxide films from surfaces of panels so as to allow for easy attachment of dry films; a step of laminating dry films on panels; a step of reproducing a circuit pattern on the disk through an exposure; a step of stripping off the non-hardened portion; a step of testing the circuit pattern; a step of plating inner surfaces of holes and the circuit pattern portion; a step of lead plating for forming anti-corrosion films on panels; a step of removing dry films remaining at the surface of the circuit pattern; a step of etching the circuit pattern so as to remove a copper foil excluding the circuit pattern; a step of removing the anti-corrosion films; a step of removing oxide films and foreign substances from panels; a step of coating the circuit pattern with an PSR ink; a step of drying the PSR ink; a step of irradiating light so as to remove the PSR ink from a surface of an SMD; a step of removing the hardened ink from the surface of the SMD; a step(s20) of drying the PSR ink; a step of performing a bare board test; and a step of vacuum packaging the product. The method further includes a series of plated film protection steps between the step(s20) and the step of performing the bare board test.