发明名称 |
METHOD OF FORMING CONTINUOUSLY COMPOSITE DIELECTRIC FILMS USING ALD WITH REACTION MATERIAL AND METHOD OF MANUFACTURING CAPACITOR USING THE SAME |
摘要 |
PURPOSE: A method of forming composite dielectric films and a method of manufacturing a capacitor using the same are provided to form sequentially thin films with different decomposition temperature in one chamber by performing an ALD(Atomic Layer Deposition) using a reaction material with a large temperature window. CONSTITUTION: A substrate is loaded in a reaction chamber(S10). A first metal(S20) is adsorbed on the substrate by providing a first metal compound to the reaction chamber(S20). A first dielectric film is formed by oxidizing the adsorbed first metal by providing oxidizing gas to the reaction chamber(S30). A second metal is adsorbed on the first dielectric film by providing a second metal compound to the reaction chamber(S40). The second metal compound is a metal alkoxide compound with electron withdrawing group substituted for at least one hydrogen. A second dielectric film is formed by oxidizing the adsorbed second metal by providing oxidizing gas to the reaction chamber(S50).
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申请公布号 |
KR20040100766(A) |
申请公布日期 |
2004.12.02 |
申请号 |
KR20030033230 |
申请日期 |
2003.05.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, GI HYEON;KO, CHANG HYEON |
分类号 |
H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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主权项 |
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