发明名称 METHOD OF FORMING CONTINUOUSLY COMPOSITE DIELECTRIC FILMS USING ALD WITH REACTION MATERIAL AND METHOD OF MANUFACTURING CAPACITOR USING THE SAME
摘要 PURPOSE: A method of forming composite dielectric films and a method of manufacturing a capacitor using the same are provided to form sequentially thin films with different decomposition temperature in one chamber by performing an ALD(Atomic Layer Deposition) using a reaction material with a large temperature window. CONSTITUTION: A substrate is loaded in a reaction chamber(S10). A first metal(S20) is adsorbed on the substrate by providing a first metal compound to the reaction chamber(S20). A first dielectric film is formed by oxidizing the adsorbed first metal by providing oxidizing gas to the reaction chamber(S30). A second metal is adsorbed on the first dielectric film by providing a second metal compound to the reaction chamber(S40). The second metal compound is a metal alkoxide compound with electron withdrawing group substituted for at least one hydrogen. A second dielectric film is formed by oxidizing the adsorbed second metal by providing oxidizing gas to the reaction chamber(S50).
申请公布号 KR20040100766(A) 申请公布日期 2004.12.02
申请号 KR20030033230 申请日期 2003.05.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HWANG, GI HYEON;KO, CHANG HYEON
分类号 H01L21/205;(IPC1-7):H01L21/205 主分类号 H01L21/205
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