发明名称 |
Packaging component and semiconductor package |
摘要 |
A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.
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申请公布号 |
US2004232534(A1) |
申请公布日期 |
2004.11.25 |
申请号 |
US20040835007 |
申请日期 |
2004.04.30 |
申请人 |
SHINKO ELECTRIC INDUSTRIES, CO., LTD. |
发明人 |
SEKI KAZUMITSU;YOSHIE TAKASHI;SATO HARUNOBU;MIYAHARA YOSHIHITO |
分类号 |
H01L23/50;C25D5/02;C25D5/12;C25D7/12;H01L23/433;H01L23/495;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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