发明名称 METHOD FOR DETECTING ABNORMALITY OF MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for accurately and rapidly detecting the stress abnormality of a mold clamping device like the breakage of a tie bar. SOLUTION: In the respective tie bars 6 of the mold clamping device 1 composed of a fixed platen 2 having a fixed mold 8 attached thereto, a movable platen 3 having a movable mold 9 attached thereto, a drive means 4 for performing the separation, approach and clamping of the movable mold 9 with respect to the fixed mold 8 and a plurality of the tie bars 6 expandedly disposed between the drive means 4 and the fixed platen 2 and guiding the movable platen 3, the stresses of the inner surface opposed to the fixed mold 8 and the outer surface on the side opposed to the inner surface through the tie bars 6 are measured to calculate the difference between the stresses. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004268312(A) 申请公布日期 2004.09.30
申请号 JP20030059356 申请日期 2003.03.06
申请人 MEIKI CO LTD 发明人 HONJO YUTAKA;SUGITA KENJI
分类号 B29C45/64;B29C45/76;B29C45/84;(IPC1-7):B29C45/84 主分类号 B29C45/64
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