Method for preparing copper foil with insulating layer and cooper foil with insulating layer prepared by the method, and printed wiring board using the cooper foil with insulating layer

摘要

To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted "a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state."