| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition excellent in moldability and soldering resistance. SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a cure accelerator, (D) an inorganic filler, and (E) a silane coupling agent derived by cationizing with ammonium cations at least part of the amine or heterocyclic nitrogen compound of a silane coupling agent having an amine-containing or heterocyclic-nitrogen-compound-containing structure. COPYRIGHT: (C)2004,JPO
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