| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a junction which has high strength at a jointed part to enhance reliability in a junction. <P>SOLUTION: The junction comprises a conductive wire 3 essentially composed of copper, and a terminal electrode 2 which is arranged on the surface of a substrate 1 and to which the conductive wire 3 is jointed by soldering. The solder 4 contains Au, and a reaction layer 5 containing Au and Cu forms a petal shape between the conductive wire 3 and the solder 4. Particularly it is preferred that the solder 4 contains Sn while Au is a constituent of 50-85 mass%, and Sn is a constituent of 15-50 mass%. <P>COPYRIGHT: (C)2004,JPO |
