| 摘要 |
PROBLEM TO BE SOLVED: To easily increase the height of a three-dimensional structure. SOLUTION: In the manufacturing method for an article with a fine surface structure, since it is considered that the maximum value of the height of a resist after lithographing and development is 0.8μm or less, considering a relationship between electron beam lithography equipment and a photosensitive material, a mold 4a (of a 0.4-times reduced structure), which has an objective height of 1.5μm multiplied by 0.6/1.5, is manufactured on a silicon substrate. After that, the shape of the silicon mold 4a is transferred to a quartz intermediate material 10 which is separately provided, so that an intermediate mold 10a can be obtained. Finally, the shape of the intermediate mold 10a is transferred to a quartz material which is a final product material 14. In this case, the transfer is performed at a selection ratio of 1.6 (a height after the transfer is obtained by the following multiplication: 0.96μm×1.6=1.53μm). COPYRIGHT: (C)2004,JPO |
