| 发明名称 |
Slurry for polishing copper-based metal |
| 摘要 |
A slurry for polishing copper-based metal containing a silica polishing material, an oxidizing agent, an amino acid, a triazole-based compound and water, wherein a content ratio of amino acid to triazole-based compound (amino acid/triazole-based compound (weight ratio)) is 5 to 8. |
| 申请公布号 |
US2004020135(A1) |
申请公布日期 |
2004.02.05 |
| 申请号 |
US20030622735 |
申请日期 |
2003.07.21 |
| 申请人 |
NEC ELECTRONICS CORPORATION;TOKYO MAGNETIC PRINTING CO., LTD |
发明人 |
TSUCHIYA YASUAKI;INOUE TOMOKO;SAKURAI SHIN;AOYAGI KENICHI;ITAKURA TETSUYUKI |
| 分类号 |
B24B37/00;C09G1/02;C09K3/14;H01L21/304;H01L21/321;(IPC1-7):C09G1/02;C09G1/04 |
主分类号 |
B24B37/00 |
| 代理机构 |
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