发明名称 |
Photosensitive resin composition |
摘要 |
<p>The photosensitive resin composition of the present invention is an excellent photosensitive resin composition: exhibiting significant transmissibility at the use of an exposure light source of 160 nm or less, more specifically F2 excimer laser light , where line edge roughness and development time dependence are small and a problem of footing formation is improved; and comprising a resin which decomposes by an action of acid to increase the solubility in alkali developer, in which the resin contains a specific repeat unit; a compound capable of generating an acid upon irradiation with one of an actinic ray and a radiation, in which the compound includes at least two kinds of compounds selected from the group consisting of specific compounds (B1), (B2), (B3) and (B4).</p> |
申请公布号 |
EP1376232(A1) |
申请公布日期 |
2004.01.02 |
申请号 |
EP20030012226 |
申请日期 |
2003.06.06 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
KANNA, SHINICHI;MIZUTANI, KAZUYOSHI;SASAKI, TOMOYA |
分类号 |
G03F7/004;G03F7/039;(IPC1-7):G03F7/039 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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