| 摘要 |
<p>1,199,231. Printed circuit assemblies; solid circuits. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 29 Feb., 1968 [14 March, 1967], No. 9885/68. Headings H1R and H1K. In order to prevent adhesive which is used to bond a solid-state circuit or device to a printed circuit board from spreading over the printed wiring the board is provided with a raised insulating barrier to confine the adhesive. Support plate 1 is provided with insulating barriers 7 printed on the support plate by a printing method and baked which surround solid state circuits 2 and prevent adhesive used to bond circuits 2 to plate 1 from spreading over printed conductors 3 and terminals 4 and connecting wires 6. Two neighbouring barriers 7 may be joined together as at 8 to form connecting bridges which insulate conductors from one another where they cross. Passive elements such as printed resistors 5 may be provided.</p> |
