发明名称 Enhanced interface thermoelectric coolers using etched thermoelectric material tips
摘要 A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes an electrical conductor thermally coupled to a cold plate and a thermoelement electrically coupled to the electrical conductor. The thermoelement is constructed from a thermoelectric material and has a plurality of tips through which the thermoelement is electrically coupled to the electrical conductor. The thermoelectric tips provide a low resistive connection while minimizing thermal conduction between the electrical conductor and the thermoelement.
申请公布号 US6608250(B2) 申请公布日期 2003.08.19
申请号 US20000731614 申请日期 2000.12.07
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GHOSHAL UTTAM SHYAMALINDU
分类号 H01L35/32;H01L35/16;H01L35/30;H01L35/34;(IPC1-7):H01L35/34 主分类号 H01L35/32
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