| 发明名称 |
ADHESIVE MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive material improving thermal conductivity while keeping a prescribed adhesive strength. <P>SOLUTION: This adhesive material comprises a resin and a filler as essential components. The content of the filler based on the nonvolatile components in the adhesive material is 30-70 vol.%, and the thermal conductivity of the cured product of the adhesive material is ≥2 W/mK. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003221573(A) |
申请公布日期 |
2003.08.08 |
| 申请号 |
JP20020327745 |
申请日期 |
2002.11.12 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
HAYASHI HIROKI;INADA TEIICHI;KAWASUMI MASAO;YAMADA KAZUHIKO |
| 分类号 |
C09J7/00;C09J11/04;C09J163/00;C09J201/00;H01L21/52 |
主分类号 |
C09J7/00 |
| 代理机构 |
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