| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-sealed semiconductor device, which is capable of surely and stably forming a low loop of a bonding wire when a semiconductor element and an inner lead are electrically connected together with a bonding wire. <P>SOLUTION: In the method for manufacturing the resin-sealed semiconductor device, a semiconductor element 2 and an inner lead 1 to be electrically connected to an external terminal are electrically connected together with a bonding wire 3. The method comprises an electrical conduction step ST1 of keeping a first surface 20 of the semiconductor element 2 where the bonding wire 3 is bonded first at a first support level 60 higher than a second surface 30 of the inner lead 1 and of electrically connecting the semiconductor element 2 and the inner lead 1 together with the bonding wire 3, and a sealing step ST2 of keeping the semiconductor element 2 at a second support level 65 lower than the first support level 60 and of sealing up the semiconductor element 2 with resin. <P>COPYRIGHT: (C)2003,JPO |
