| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate holder which is capable of sucking the front surface of a substrate flatly without contaminating the rear face of the substrate. SOLUTION: The substrate holder comprises a silicon wafer 1, a chuck table 2, a vacuum chuck 3, a vacuum pump 4, vacuum paths 51 and 52, and valves 61, 62, 63, and 64. The vacuum paths 51 and 52 are formed in the chuck table 2. Spaces which are sealed by the bottom face of the silicon wafer 1, the top face of the vacuum chuck 3, and the inner surface of mound sections 31 and spaces which are sealed with the top face of the chuck table 2, the bottom face of the vacuum chuck 3, the inner surfaces of the mound sections 31, and the outer surfaces of mound sections 33 are formed. By depressurizing these sealed places by means of the vacuum pump 4, the silicon wafer 1 and the vacuum chuck 3 can be held.</p> |
