发明名称 SOLDERING AND PLATING METHOD OF ICE MAKING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a soldering and plating method of an ice making plate that can apply soldering and plating to an ice making plate easily without plating failure. SOLUTION: Solder 5 that has been heated to the melted or half-melted state is sprayed toward a mask 2 from a nozzle of a solder thermal spraying device 3. Then, the solder 5 that passed through cut-out parts 4 of the mask is applied to an ice making plate 1, which enables the solder to be selectively applied to only target parts. Flux is sprayed on the solder 5 on the ice making plate 1 from a flux spraying device and the solder and the flux on the ice making plate 1 are heated by an infrared heater.
申请公布号 JP2003106718(A) 申请公布日期 2003.04.09
申请号 JP20010297435 申请日期 2001.09.27
申请人 HOSHIZAKI ELECTRIC CO LTD 发明人 KITO HIDEAKI
分类号 F25C1/12;(IPC1-7):F25C1/12 主分类号 F25C1/12
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