发明名称 MANUFACTURING METHOD FOR THERMOPILE INFRARED SENSOR
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a thermopile infrared sensor which can easily be manufactured at a low cost. SOLUTION: On a silicon substrate 1, many films 6 and 8 of different kinds of materials are extended alternately in series; and alternate joint parts 11 are covered with an infrared-ray absorption film 10 and a through-hole 2 is bored in the silicon substrate 1 below them. After the films 6 and 8 of different kinds of materials are formed on the main surface side of the silicon substrate 1, the through-hole 2 is bored, by etching the silicon substrate 1 from its reverse surface side and then the infrared absorbing film 10 is formed, by screen printing on the main surface side of the silicon substrate 1. The pressure that the silicon substrate 1 receives during the screen printing is set to >=0.25 MPa.
申请公布号 JP2003101083(A) 申请公布日期 2003.04.04
申请号 JP20010341066 申请日期 2001.11.06
申请人 NIPPON SOKEN INC;DENSO CORP 发明人 YOSHIDA TAKAHIKO;SUZUKI YASUTOSHI;TOYODA INEO
分类号 G01J1/02;G01J5/02;G01J5/12;G01J5/14;H01L27/14;H01L35/14;H01L35/32;H01L35/34;(IPC1-7):H01L35/14 主分类号 G01J1/02
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