Method for thinning and polishing the die of integrated circuits,申请号AU20020255691-传众专利搜索

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发明名称	Method for thinning and polishing the die of integrated circuits
摘要
申请公布号	AU2002255691(A1)	申请公布日期	2002.09.24
申请号	AU20020255691	申请日期	2002.03.11
申请人	SCHLUMBERGER TECHNOLOGIES, INC.	发明人	CHUN-CHENG TSAO;JOHN VALLIANT
分类号	B24B1/00;B24B7/22;B24B37/04;B24B49/12;(IPC1-7):B24B37/04	主分类号	B24B1/00
代理机构		代理人
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地址

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