| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion strength of Al wire, to suppress the peeling of the surface layer of a bonding part bringing such effect and to more securely prevent disconnection from the connection part of a lead pin and the Al wire in a lead terminal member for semiconductor module. SOLUTION: The lead terminal member for semiconductor module, the Al wire is bonded to an inner side and wiring, a circuit and a terminal are directly solder-connected to an outer side or through a plating layer. The member is provided with a lead terminal main body 2 constituted of Cu or Cu alloy and a bonding part 3 which is partially buried/connected into the lead terminal main body 2 and is constituted of Al or Al alloy whose thickness is not less than 15μm and which is not more than 50% of the total thickness of the lead terminal member 1. The semiconductor module has the lead pin constituted of the lead terminal member 1. |
