Embossed carrier tape, method of manufacturing the same and the metal molds used herein

摘要

An embossed carrier tape, having a concave region (21a) for placing an electronic part on one surface (20a) and a convex region (21b) complementary to the concave region (21a) on a second surface (20b) is disclosed. The width (L2) at the top of the convex region (21b) is longer than the width (L1) of the opening of the concave region (21a), while the width (L1) of the opening of the concave region (21a) is longer than the width (L3) at the bottom. With this arrangement, when the embossed carrier tape 20 is vertically overlapped with the convex regions (21b) being oriented downward, the convex region (21b) of the upper embossed carrier tape (20) is unable to enter the concave region (21a) of the under embossed carrier tape.