发明名称 METHOD FOR RECOGNIZING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for recognizing an electronic component, in which positional displacement of a connection terminal can be recognized easily in the height direction. SOLUTION: In the method for recognizing an electronic component, depth of field S of a focus lens 12 is determined, with reference to the coating thickness H at a soldered part 21 which is applied to a circuit board 20. When an electronic component A and an image sensor 9 are moved in the height direction P of a connection terminal 4, to approach each other or recede from each other, the image of the connection terminal 4 picked up by means of the image sensor 9 is obtained with a prescribed resolution in the height direction P. When, for example, the images of all connection terminals 4 at the connecting parts appear with the same timing in the substantially same state, a decision can be made that all connection terminals 4 are in proper states in the height direction. When a trouble occurs in the height direction at prescribed connection terminals 4A, 4B, only these connection terminals 4A, 4B at the connecting parts are imaged with a timing which is ahead of or lags in time behind the images of other properly connected terminals 4 at the connecting parts.
申请公布号 JP2002057500(A) 申请公布日期 2002.02.22
申请号 JP20000246314 申请日期 2000.08.15
申请人 NIDEC COPAL CORP 发明人 OE HARUKI
分类号 G01B11/00;G01N21/956;H05K13/08 主分类号 G01B11/00
代理机构 代理人
主权项
地址