发明名称 A method and apparatus for interconnecting multiple devices on a circuit board
摘要 <p>A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first device to a set of signal lines. A second attach region on a second surface is for coupling a second set of pins from a second device to the set of signal lines. The second attach region is predominantly non-overlapping with respect to the first attach region.</p>
申请公布号 GB0128926(D0) 申请公布日期 2002.01.23
申请号 GB20010028926 申请日期 2000.05.25
申请人 INTEL CORPORATION 发明人
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利