发明名称 Method and an apparatus for manufacturing multilayer electronic part
摘要 A method of manufacturing multilayer electronic parts including a processing step asnd an apparatus for manufacturing multilayer electronic parts including a processing apparatus for subjecting a green sheet to a predetermined processing by irradiating it with the laser beam. A green sheet attached to the periphery of one of two drums is subjected to the predetermined processing by irradiating it with the laser beam from a beam irradiation means while allowing the drum to rotate about a drum's centerline as an axis and travel in the direction of the drum's centerline. And while subjecting the green sheet to the processing, processed green sheets are detached from the periphery of the other drum and unprocessed green sheets are attached to it with a sheet attaching/detaching means.
申请公布号 US2001053616(A1) 申请公布日期 2001.12.20
申请号 US20000736407 申请日期 2000.12.15
申请人 TAIYO YUDEN CO., LTD. 发明人 NAKAZAWA MUTSUO;UENO MITSUO;YAMANAKA AKIRA;OYAMA KATSUHIRO;TAKAKUWA SATOSHI;TAKAHASHI HIROSHI
分类号 H01F41/04;H01F17/00;H01F21/06;H01F41/00;H01L21/48;H05K1/03;H05K3/00;(IPC1-7):H01L21/26;H01L21/42 主分类号 H01F41/04
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