Device for imaging object to be inspected and device for inspecting semiconductor package

摘要

An inspection object imaging device, which images a plurality of objects to be inspected that are located at different imaging distances from imaging means, in which a light transmitting optical member which has a predetermined refractive index and a thickness and which absorbs the differences of the imaging distances is provided in an optical path between the objects to be inspected and the imaging means. When the objects whose optical path lengths from the imaging means are different are imaged by one imaging means, all the objects can be focused simultaneously, so that the time required for the imaging can be reduced and, further, a high quality image can be obtained over the whole imaged region.