发明名称 DRILLING METHOD AND METHOD MANUFACTURING PRINTED WIRING BOARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a drilling method by which holes can be drilled in a short time with high productivity, and to provided a method of manufacturing a printed wiring board using it. SOLUTION: In this drilling method, holes are drilled through a laminated board, composed of a resin and metallic foil by projecting a carbon dioxide laser beam upon the laminated board from the metallic foil side. In the method of manufacturing the printed wiring board, a metal foil with resin in integrated with an inner-layer circuit board having an inner-layer circuit by pressing the foil against the circuit board by heating after the foil is laid on the circuit board and a hole reaching an inner layer is made. Then the inner layer is connected electrically to the metal foil and an outer-layer circuit is formed by machining the metal foil. At drilling of the hole reaching the inner layer, a carbon dioxide laser beam is irradiated upon the laminated board composed of the resin and metallic foil from the metal foil side.
申请公布号 JP2001177211(A) 申请公布日期 2001.06.29
申请号 JP19990362024 申请日期 1999.12.21
申请人 HITACHI CHEM CO LTD 发明人 ITO TOYOKI;ARIGA SHIGEHARU;URASAKI NAOYUKI;TAKAI KENJI;OTSUKA KAZUHISA
分类号 H05K3/00;H05K3/46;(IPC1-7):H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址