POLYIMIDE ADHESIVE FOR ELECTRONIC COMPONENT AND PREPARATION METHOD OF ADHESIVE TAPE USING THE POLYIMIDE ADHESIVE

摘要

PURPOSE: A polyimide adhesive and a method for preparing an adhesive tape using the polyimide adhesive are provided, which adhesive is used for adhering electronic components such as components adjacent to lead frame and semiconductor chips, and is improved in electrical insulation and heat resistance. CONSTITUTION: The polyimide adhesive is obtained by coating an adhesive containing polyimide as a main component and drying an organic solvent to remove it or by making imide from poly(amide acid) solution, wherein the polyimide adhesive comprises at least one selected from the repeating unit represented by the formula 1a or 1b and at least one selected from the repeating unit represented by the formula 2a or 2b; at least one selected from the repeating unit represented by the formula 1a or 1b and at least one selected from the repeating unit represented by the formula 3a or 3b; or at least one selected from the repeating unit represented by the formula 1a or 1b, at least one selected from the repeating unit represented by the formula 2a or 2b, and at least one selected from the repeating unit represented by the formula 3a or 3b.