Mfg. semiconductor disc with reflection degree exceeding 98 per cent by concatenation of process steps

摘要

The concatenation comprises separating a mono-crystal by grinding, mechanical surface treatment, such as polishing, lapping and edge rounding, and mechanical and chemo-mechanical buffing steps .After each mechanical surface treatment the crystal grid structure of the semiconductor disc is examined by micro-Raman spectroscopy. The process steps and the used machines are monitored by the spectroscopic data.