| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor exposure system to be improve in throughput by a method wherein a first action through which a specimen is delivered from a specimen chamber to an exposure system and a second action through which a specimen is delivered from the exposure system to the specimen chamber are separately carried out. SOLUTION: When a control device outputs an unloading gate signal SugA, an unloading gate 532A is opened. When the control device outputs an unloading signal Su1 to deliver a wafer We from a wafer stage WS to an unloading chamber 531, and unloading robot 533 delivers a wafer We to the unloading chamber 531. When the control device outputs a loading signal S1gB, the loading gate 522B is closed. When the control device outputs a suction valve signal Sv1 to open a suction valve 524, and the inner pressure of the loading chamber 521 gets equal to the pressure of outside air. That is, a wafer loading device 5 delivers a wafer Wu from a wafer chamber 511 to a wafer stage WS and also delivers a wafer We from the wafer stage WS to the wafer chamber 511 in parallel. |
